Tyler Leuten is a highly skilled engineering professional with a strong background in packaging and testing for prominent technology companies. With experience as a Package R&D Engineer at Solidigm, a Packaging Engineer at AMD, and a Package Pathfinding Engineer at Intel/Solidigm, Tyler has developed expertise in advanced packaging solutions. Prior experience includes serving as a Test Engineer at L3 Technologies, contributing to a comprehensive understanding of engineering processes in the tech industry.
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