SOMOS IWT is a manufacturer of industry-leading equipment & technologies for critical surface preparation and material slicing to high technology industries.

 Our equipment technologies include:
•	Double-side lapping & polishing
•	Single-side lapping & polishing
•	Diamond wire slicing – Single-wire, multi-wire

Markets served – Precision Optics, Silicon Carbide, Semiconductor, Crystals, Ceramics, Sapphire, Electronics

Our turnkey solutions will allow us to support the markets most demanding and advancing requirements is high precision machining of flat, parallel, and surface finishes.  

SOMOS IWT is dedicated to support our customers with the most advanced surfacing and slicing production equipment available. Also, through sustaining engineering and R&D efforts keep pace with the technology advancements in the markets we serve. 



SOMOS IWT, Inc.

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