Sonics, Inc.
Chwei King Mok has extensive experience in hardware design and architecture, currently serving as a Senior IP Logic Designer at Intel Corporation since 2010, where responsibilities include leading the Soft IP Group in PCIe based fabric development and co-developing a configuration management tool. Mok's previous role as a Senior Hardware Architect at Sonics, Inc. since 2001 involved architecture design and RTL development for the SMART Interconnect family, along with managing a team and contributing to product strategy. Earlier experience includes a position as a Hardware Engineer at PacketStream, Inc., focusing on microarchitecture and RTL development for QoS products. Chwei King Mok holds a Master of Science in Electrical Engineering and a Bachelor of Science in Electrical Engineering with honors, both from the University of Kentucky.
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Sonics, Inc.
Sonics, Inc. is the trusted leader in on-chip network (NoC) and power-management technologies used by the world's top semiconductor and electronics product companies, including Broadcom®, Marvell®, MediaTek, and Microchip®. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Based on the ICE-Grain™ Power Architecture, Sonics' ICE-G1™ is the industry’s first complete Energy Processing Unit (EPU), which enables rapid development of SoC power management subsystems. Sonics is also a catalyst for ongoing discussions about design methodology change via the Agile IC Methodology LinkedIn group. Sonics holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit sonicsinc.com and follow us on Twitter (@sonicsinc).