Sonics, Inc.
Leon Le is a seasoned Logic Design Engineer with extensive experience in the semiconductor and telecommunications industries. At Sonics, Inc. since September 2007, Leon focuses on OCP SoC intelligent interconnect solutions, overseeing the maintenance of target agents and developing shared common components. Previous roles include Engineering Consultant at Magnum, where Leon contributed to an audio/video codec project, and Member of Technical Staff at Silicon Graphics, Inc., specializing in functional verification for the RASC program. Early career experiences include positions as a Design Engineer at Iospan Wireless, C-Cube Microsystems, and NEC, where Leon gained expertise in micro-architecture, RTL coding, and systems integration. Leon holds a Bachelor of Science degree in Electrical Computer Engineering from the University of California, Davis.
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Sonics, Inc.
Sonics, Inc. is the trusted leader in on-chip network (NoC) and power-management technologies used by the world's top semiconductor and electronics product companies, including Broadcom®, Marvell®, MediaTek, and Microchip®. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Based on the ICE-Grain™ Power Architecture, Sonics' ICE-G1™ is the industry’s first complete Energy Processing Unit (EPU), which enables rapid development of SoC power management subsystems. Sonics is also a catalyst for ongoing discussions about design methodology change via the Agile IC Methodology LinkedIn group. Sonics holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit sonicsinc.com and follow us on Twitter (@sonicsinc).