Gary Boyer

Gary Boyer is a seasoned Sr. Process Engineer with extensive experience in semiconductor manufacturing, specializing in various etching and deposition processes. Currently employed at Soraa since January 2016, Gary focuses on GaN and nitride etching, PECVD processes, and furnace technology. Previously, Gary contributed to wafer fabrication at Micrel since May 2005, overseeing Diffusion, LPCVD, and PECVD processes for 0.35-micron technology. Gary also held the position of Sr. Process Engineer at Onspec Technologies from 2003 to 2005 and was a Process Engineer at National Semiconductor from May 1988 to August 1999, where responsibilities included CMP process engineering in a 200MM fab. Gary holds a Bachelor of Science degree in Chemistry from San Jose State University, completed between 1972 and 1973.