Yang Wu

Yang Wu is a senior hardware reliability engineer at SpaceX, specializing in advanced IC packaging with over five years of industry experience. They have a strong background in package design, assembly process development, and quality assurance, particularly in 2.5D and 3D architectures. Prior to joining SpaceX, Yang served as a senior package R&D engineer at Intel, where they led chip attachment projects, and they also gained experience at Panasonic Energy and as a graduate research assistant at the University of Connecticut, where they focused on materials science. Yang holds a PhD in Materials Science and a Master’s degree in Materials Science and Engineering from the University of Connecticut, along with a Bachelor's degree in Chemistry from Dalian University of Technology.