Bin Hu

Bin Hu is a seasoned engineering professional with extensive experience in the technology sector, currently serving as the Head of Engineering in China at Spectricity since September 2024. Previously, Bin held the position of Senior Principal Architect at GigaDevice Semiconductor Inc., focusing on new product development based on ultrasonic technology. A significant tenure at Fingerprint Cards spanned nearly a decade, where Bin contributed as a Product Manager, managing under-display fingerprint products and successfully launching them on various mobile phones. Bin also served in multiple roles, including System Engineer and Team Lead, leading cross-functional teams and managing complex R&D projects in optical fingerprint sensing technology. Academic credentials include a Ph.D. in Wireless Communications and a Master's degree in Digital Communications from Aalborg University, complemented by foundational studies at Jilin University. Bin Hu's expertise encompasses algorithm design, project management, customer engagement, and market analysis in the field of semiconductor and biometric technologies.