Philip Chiu

Philip Chiu is a highly experienced professional in the field of materials science and engineering, currently serving as a Boeing Technical Fellow at Boeing since January 2022. Previously, Philip served as a Boeing Associate Technical Fellow at Spectrolab, where responsibilities included overseeing over $5 million in external government programs and managing IAD programs while contributing to the design and modeling of multijunction space cells. Earlier roles included MOCVD Scientist at Spire, where Philip co-directed the development of a highly efficient triple junction solar cell, and Research Assistant at Northwestern University, focusing on MOCVD growth of magnetic semiconductor devices and optical analysis of semiconductor films. Philip holds a PhD in Materials Science and Engineering from Northwestern University and a Bachelor of Science in Chemistry from Amherst College.