David Gani is currently the Director of Package R&D at STMicroelectronics, where they lead package development and manage projects focused on manufacturing processes for camera and optical sensors in mobile applications. From 2004 to 2023, David served as Project and Package Development Manager at STMicroelectronics, overseeing back end packaging projects. Earlier in their career, David worked as a Process Engineer at PT Unisem Batam Indonesia from 2000 to 2004, specializing in semiconductor back end operations. David holds a degree from Universitas Gadjah Mada, having studied there from 1995 to 2000.
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