Fulvio Fontana is currently an R&D Senior MEMS packaging designer at STMicroelectronics, where they design MEMS packaging for various applications, including medical products. Prior to this, Fulvio worked as an Advanced Packaging Senior Engineer at Celestica from 2000 to 2006, focusing on Flip Chip and Wire Bonding processes, alongside medical product development. They also have extensive experience from their tenure at IBM as a Process Engineer from 1983 to 2000, managing clean room operations and developing hydrogen/nitrogen facilities. Fulvio holds a Laurea in Mechanical Engineering from Politecnico di Milano, earned between 1977 and 1983.
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