MC (Ming-Chung) Chang is currently the Package Development and Project Management Manager at 意法半導體, where they focus on Flip chip Die bond processes. With 8.5 years of NPI experience specializing in FCBGA packaging, MC previously worked as a Process Engineering Manager at 矽品精密工業股份有限公司 and as a Process Engineer at 台積電. MC holds a Master of Science and a Bachelor of Science in Chemistry from 國立清華大學.
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