Patrick Laurent is a semiconductor packaging assembly manager currently serving as a Senior Assembly TPM at UTAC since 2023. Previously, they held various positions at STMicroelectronics, including Project Leader and Flip Chip Process Engineer from 2003 to 2005, and Optical Package Platform Leader from 2013 to 2021. They were also the Assembly Technology R&D and Pilot Line Manager, overseeing the assembly process roadmap and prototyping activities for new packaging technologies. Patrick earned a degree in Material Sciences from ENSEEG: Ecole Nationale Superieure d'Electrochime et d'Electrometallurgie Grenoble between 1996 and 1999.
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