HS Tan is currently the VP of Wire Bond Operations, Business Office, and Planning at STATS ChipPAC Shanghai Ltd., a position held since 2016. Previously, HS worked at Motorola Seremban / ON Semiconductor from 1992 to 2007, where they held various roles including Manager and Senior Process Engineer. Between 2010 and 2014, HS served as Senior Director in multiple areas, overseeing Customer Service, Supply Chain, and Laminate Operations at STATS ChipPAC Shanghai. HS earned a Bachelor's degree in Electrical and Electronics Engineering from the University of Liverpool from 1988 to 1991.
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