STATS ChipPAC
Jeff Howell is an accomplished sales leader with extensive experience in the semiconductor and wireless technology sectors. Currently serving as the Senior Vice President of International Sales Key Account Management at STATS ChipPAC Ltd. since May 2003, Jeff manages a team focused on high-value relationships with major Fabless and Integrated Device Manufacturing companies. Prior experience includes the role of Vice President of Sales at Zucotto Wireless, Inc., where Jeff directed sales and business development for innovative technology in the wireless handset market, and a long tenure at Kyocera America, Inc. as Vice President of Sales and Marketing, where Jeff was responsible for significant revenue generation and strategic direction within the North American sales group. Jeff holds a Bachelor of Fine Arts in Public Relations with a business minor from Southern Methodist University and completed executive development focused on leading effective sales teams at The Wharton School, University of Pennsylvania.
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STATS ChipPAC
STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.