STATS ChipPAC is the world’s leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. 

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

Automotive

Electronics

Packaging Services

Semiconductor

STATS ChipPAC

This department focuses on the design, development, and optimization of engineering processes and equipment.

Engineering and Development

This department focuses on managing employee relations, recruitment, and organizational development.

Human Resources

This department focuses on managing client relationships and ensuring customer satisfaction through dedicated account managers.

Account Management

This department focuses on the testing and engineering of product features and systems to ensure quality and performance.

Product Test Engineering

This department focuses on managing and optimizing the processes involved in the introduction of new products.

New Product Introduction

This department focuses on creating growth opportunities and strategic initiatives to enhance market presence and drive revenue.

People (39)

Jobs (0)

Other teams

Human Resources

Account Management

Product Test Engineering

New Product Introduction

Business Development