Darshan Honnesh is a Packaging Development Executive at Strides since June 2023, focusing on the development of new packaging materials for formulation studies and proposing primary packaging materials for stability studies. Previously, Darshan completed an internship in Packaging Development at ITC Limited from January to June 2023, where responsibilities included working on flexible packaging development, assisting in new product packaging, and liaising with vendors to ensure sample approval and understand customer needs. Prior experience includes a role as a Network Technician at Wavecom Solutions from June 2020 to January 2021, specializing in antenna and RRU installation and site surveys. Darshan holds a degree in Printing and Packaging Technology from SIES Graduate School of Technology, completed in August 2023.
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