Summit Interconnect
Erika James is currently working as a Sales - Aerospace and Defense at Summit Interconnect since December 2017. Prior to that, Erika held the position of Global Account Manager and Credit Manager at TTM Technologies from July 2008 to December 2017. Before joining TTM Technologies, Erika worked as a Public Records at Experian from February 2007 to June 2008, and as a Priority Investigator at TransUnion LLC from September 2001 to October 2006.
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Summit Interconnect
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn manufacturing and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.