Summit Interconnect
Michael Trammel has a diverse background in the electronic technology and engineering industry spanning over three decades. Starting their career at Phototek Inc. and eventually moving on to roles at B&B Custom Circuit Supply, Morton Electronic Materials, and DDI, Michael has gained extensive experience in technical sales, engineering management, and product support. Currently serving as the Director of Product and Technology Transfer at Summit Interconnect and Director of Engineering at Streamline Circuits, Michael has a strong track record of driving sales, providing technical support, and managing global teams in the PCB manufacturing sector. With a solid educational foundation in Electronics/Electrical Engineering, Michael continues to excel in their field.
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Summit Interconnect
Summit Interconnect is one of the leading providers of complex, rigid, and flexible printed circuit boards in North America, offering solutions ranging from advanced prototyping to high mix, low-to-mid volume production. Summit serves customers across the aerospace, defense, and other highly demanding commercial sectors and has facilities in California, Illinois, and Toronto, Canada. Summit is a recognized industry leader in quick-turn manufacturing and has expertise with a wide range of materials like high-speed digital, RF/microwave, and mixed constructions.