Patrick MacPherson held the position of National Sales Manager at MEI for nearly 15 years before transitioning to their current role as Vice President of Sales in the Aerospace & Defense sector at Summit Interconnect. With 28 years of experience in the Printed Circuit Industry, Patrick utilizes their extensive knowledge of materials, HDI complexity, and IPC standards to drive successful development of PWB’s tailored for RF, Space, and HDI compliant products.
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