Henry Yang is a Senior Thermal Engineer with over 15 years of experience in thermal simulation and mechanical design. Currently working at 美超微 since 2023, Henry has previously held positions at 鴻海精密工業股份有限公司 and 中華映管股份有限公司. With expertise in thermal design, cooling solutions, and machine learning, Henry has successfully completed numerous air and liquid cooling design projects, contributing to innovations such as Supermicro's first liquid-cooled power supply unit. Henry holds advanced degrees in mechanical engineering from 國立清華大學 and 國立臺灣海洋大學.
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