Thomas Schmidt is a seasoned professional with extensive experience in the fields of microelectronics and process engineering. Currently serving as a Product Manager at SÜSS MicroTec since December 2017, Thomas focuses on Permanent Wafer Bonding, specifically automated cluster systems for various applications, including 2.5D/3D integration and MEMS. Prior experience includes a consultant role at ifectis Innovationsförderung advising SMEs on technology funding, and a lecturer position at Duale Hochschule Baden-Württemberg Lörrach, where Thomas developed a course on Microelectronics and Microelectromechanical Systems. Thomas also has a strong research background, having worked as a Graduate Research Assistant at the University of Freiburg and in various engineering roles at Qimonda, AMD, and other institutions.
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