MR

Mihir Roy

Engineering Manager - Packaging

Mihir Roy, MBA, Ph.D, has extensive experience in the semiconductor and technology sectors. Currently, Mihir serves as Engineering Manager - Packaging at Synaptics Incorporated, leading technology initiatives for biometric products and aiding in the development of product roadmaps. Prior to this role, Mihir held various positions at Intel Corporation, including Substrate Packaging Program Leader and IC Packaging Platform Integrator, where significant contributions were made to semiconductor packaging roadmaps and cost reduction strategies. Mihir began the academic journey at Rensselaer Polytechnic Institute, culminating in a Ph.D. in Nanodielectrics, and also holds master's degrees in Nanotechnology and Business Administration, showcasing a unique interdisciplinary expertise in material science and finance.

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