Brandon Hamilton is a Microelectronics Packaging Consultant with extensive experience as a Principal Microelectronics Packaging and Printed Electronics Engineer. They currently lead Printed Electronics technology at Collins Aerospace, guiding a diverse team of engineers. Brandon previously served as Advanced Packaging Chief Engineer at Booz Allen Hamilton and has held various roles in the US Navy and prominent defense and aerospace companies such as Raytheon Technologies and BAE Systems. They are currently pursuing degrees in Biochemistry from Cornell University, Business Administration and Management from Houghton College, and an Associate of Science in Science and Mathematics from Jamestown Community College.
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