Eric Springston

Eric Springston is a seasoned Staff Manufacturing & Process Development Engineer at TE Connectivity since 1998, specializing in failure analysis. In this role, Eric leads multiple projects to identify failure causes while developing efficient investigative plans and orchestrating work with support technicians. Eric utilizes advanced analytical systems such as CT X-ray and Scanning Electron Microscopes, executes reliability testing programs, performs statistical data analysis, and produces detailed reports. Previously, Eric worked as an Automation & Electronic Packaging Engineer at Die-Tech, Inc. from 1995 to 1998, designing assembly equipment and qualifying electronic packages, and as a Machinist at The Raymond Corporation from 1994 to 1995. Eric holds a Bachelor of Science in Mechanical Engineering from Binghamton University and an Associate of Science in Engineering Science from SUNY Broome Community College.