Ryan Kier

Ryan Kier has a comprehensive work experience spanning various roles and companies. Ryan began their career as an IC Design Intern at SliceX, Inc in 2006, followed by another IC Design internship at Medtronic in 2007.

Ryan then joined Crest Semiconductors in 2008 as an Analog/Mixed-signal IC design engineer, where they contributed to projects involving pipelined ADCs and time-interleaved ADCs. Ryan designed circuitry for a 250 MSPS 16-bit pipelined ADC and developed an automated trimming/tuning algorithm for optimizing the dynamic performance of a time-interleaved ADC system.

In 2013, Ryan moved to Synapse Product Development where they held multiple roles. As a Senior Electrical Engineering Tech Lead, they led a team in developing a compact form-factor PCBA for a high-speed digital video system. Ryan also provided oversight, project planning, and day-to-day task management for a cross-disciplinary team. Additionally, they worked as an Electrical Engineering Tech Lead, leading a team in designing a Li-ion battery-powered device and managing its production. Ryan collaborated with various teams to develop product requirements and design solutions.

Since 2019, Ryan has been working at Teal as a Senior Electrical Engineer, although specific details about this role are not provided.

Ryan's educational background includes being a PhD Student at the University of Utah from 2002 to 2010.

Overall, Ryan Kier's work experience demonstrates their expertise in analog/mixed-signal IC design, project management, team leadership, and collaboration with cross-disciplinary teams.

Ryan Kier obtained their Bachelor of Science (BS), Master of Science (MS), and Doctorate (PhD) degrees in Electrical Engineering from the University of Utah. Ryan completed their educational journey in this field from 1998 to 2008.