Philip Nickels

Philip Nickels is an Advanced Solutions Specialist at Tech3 since June 2015, overseeing various Advanced Solutions R&D and customer projects involving specialized industry applications and hardware, with expertise in 3D Reconstruction and Visualization, Virtual Reality, 360 Degree Imagery and Videos, and sUAS operations. Previously, Philip Nickels gained experience as a 3D Reconstruction College Intern at Hewlett-Packard from May 2014 to October 2015 and as a Performance Engineering Intern. Philip Nickels holds a Bachelor of Science in Computer Engineering from Valparaiso University and an Associate of Arts and Sciences in Electrical and Electronics Engineering from Lone Star College-University Park.