Mike Dang

Mike Dang is an operations manager at Technoprobe since January 2017, with extensive experience in high-volume manufacturing and process development. Prior to this role, Mike served as a Wafer Test Tooling Technical Supplier Chain Manager at Intel Corporation from October 1997 to June 2016, where responsibilities included managing supplier selection for wafer sort solutions, developing technical strategies, and negotiating collaboration agreements. Additionally, Mike held the position of Sort Process Development Engineer at Intel, where notable achievements included developing the first MEMS sort technology for high-volume manufacturing. Earlier in Mike's career, from January 1995 to September 1997, Mike worked as a Printed Circuit Board Process Engineer at Sanmina Corp (Hadco), successfully qualifying processes for printed circuit boards. Mike holds a Bachelor of Applied Science in Mechanical Engineering from the University of California, Davis, and further education from California Polytechnic State University-San Luis Obispo.