Ryan Meschewski, P.E. is a seasoned engineer with extensive experience in the aerospace and photonics industries. Currently serving as a Senior Engineer at Tendeg, LLC since July 2020, Ryan previously held the role of Chief Engineer at Northrop Grumman Corporation from June 2012 to July 2020, where duties included designing and fabricating innovative space deployable structures. Prior roles include Mechanical Design Engineer at Freedom Photonics, contributing to the productivity of opto-electric systems, and various research and teaching assistant positions at UC Santa Barbara and the University of Illinois at Urbana-Champaign, where Ryan focused on material properties and mechanical design. Ryan holds a Master’s Degree in Mechanical Engineering from UC Santa Barbara and a Bachelor’s Degree in Mechanical Engineering from the University of Illinois at Urbana-Champaign.
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