Sharan Dannure is a Senior IC Package Design Engineer at Tessolve Semiconductor Pvt Ltd in Bangalore, with 7 years of experience in PCB and IC package design. Sharan has expertise in wire bonding, flip chip technologies, and a range of interfaces including LPDDR5 and PCIe Gen6. Previous roles included PCB Design Engineer positions at V3 Novus Pvt Ltd and Velankani Electronics Pvt Ltd. Sharan holds a diploma in Electronics and Communication Engineering from the Department of Technical Education Karnataka.
This person is not in the org chart
This person is not in any teams
This person is not in any offices