CL

Ching-Te Lin

Process Integration Engineering (Silicon/Packaging Interaction)

Ching-Te Lin is a member of the Group of Technical Staff at Texas Instruments, with over 20 years of experience in semiconductor research and development. They managed Quality and Reliability Engineering at Texas Instruments from 2013 to 2021 and have an extensive background in Process Integration Engineering, contributing to various aspects of silicon and packaging interaction. Ching-Te earned a Ph.D. and a Master's degree in Materials Science and Engineering from the Massachusetts Institute of Technology, following a Bachelor's degree in Mechanical Engineering from National Taiwan University.

Location

Dallas, United States

Links


Org chart

This person is not in the org chart


Teams

This person is not in any teams


Offices

This person is not in any offices