Paul Lam

Paul Lam has extensive experience in process engineering, having worked with leading companies in the industry. Initial roles included Process Engineer positions at Flextronics and KESM Industries Berhad. Subsequently, at Texas Instruments from May 2015 to December 2020, Paul Lam held multiple managerial roles, including Die Attach and Wire Bond QFN Process Engineering Manager, Prebond Engineering Manager, Die Bond Process Engineering Manager, and RFID Engineering and Manufacturing Manager, alongside a role as RFID Process Engineer. Paul Lam earned a Bachelor of Engineering (BEng) in Materials and Manufacturing Engineering from Universiti Tunku Abdul Rahman, where education was completed from 2008 to 2012.