Harry Kam

Harry Kam, DBA, is an accomplished leader in the semiconductor packaging industry with extensive experience in advanced packaging operations. Currently serving as General Manager of Advanced Packaging at TF-AMD Penang since March 2024, Harry has previously held key positions including Vice President of Operations and Quality at JCET/Statschippac Spore, and Site Director at Micron Semiconductor Malaysia. Harry's career also includes a significant tenure at STATS ChipPAC as Vice President of Operations, where management of wafer-level packaging operations and leading technology development projects were pivotal responsibilities. Academic qualifications include a Doctor of Business Administration in Technology Innovation and Management from European International University in Paris, and a BSc in Mechanical Engineering from The University of Manchester Institute of Science and Technology, along with multiple certifications in fitness, health, and cognitive fitness.