David Smith

David Smith is the current Director at TiE Oregon. Prior to that, they were a Technical Advisor at Lam Research from January 2013 to March 2019. David developed and executed a program for an integrated deposition and etch system for 3D NAND, Emerging Memory (MRAM, ReRAM), and sub 5nm logic applications. Before Lam Research, David Smith was the Vice President of Engineering at MiaSolé from January 2008 to December 2012. David led the engineering organization through a transition from R&D to production. Additionally, they built a 150MW solar module manufacturing facility and ramped module production from 0.5MW to 60+ MW. From January 2004 to December 2006, David Smith was the Vice President of the Fab Products Division at FEI Company. David grew the organization and successfully placed multiple full wafer dual beams systems for 3D metrology and defect analysis at logic and data storage manufacturers. From 2006 to 2008, David Smith was the Senior Vice President at Novellus Systems before it was acquired by Lam Research Corporation. And from 1997 to 2004, they were the Vice President at Novellus Systems. Prior to that, from 1995 to 1997, David Smith was on the Technical Staff at Applied Materials.

David Smith completed a PhD in Chemistry at Caltech and a BS in Chemistry at UC Berkeley.