Ramkrishna Sai is a seasoned packaging and design engineer with extensive experience across multiple companies. Currently serving as the Lead Packaging Engineer at TransPak since February 2024, Ramkrishna Sai manages global customer shipping requirements and leads a team to foster innovative solutions. Prior to TransPak, Ramkrishna Sai held roles at HCL Technologies from July 2019 to February 2024, progressing from Technical Lead to Senior Technical Lead, where responsibilities included leading design support teams and maintaining project documentation in SAP PLM. Earlier experience includes positions at Altran Technologies and Altran Solutions as a Senior Engineer and Advance Consultant, respectively, focused on design services and material selection. Earlier career experience as a Mechanical Engineer at Vignani Technologies involved concept generation and prototyping support. Ramkrishna Sai holds a Bachelor's degree in Mechanical Engineering from Raghu Engineering College, completed in January 2008.
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