Ashish Kumar Sahoo is an accomplished engineer with a strong background in semiconductor manufacturing and epitaxy processes. Currently serving as a SoIC R&D Integration Engineer at TSMC since May 2022, Ashish has previously held the position of Project Research Assistant at National Yang Ming Chiao Tung University, where the focus was on the epitaxy and process development of InGaAs on silicon using MOCVD. Additionally, Ashish gained experience in research and development at Edprosys India from October 2016 to August 2017. Educational qualifications include a Bachelor's degree in Metallurgical Engineering from the Indian Institute of Technology, Bombay, and a Master's degree in Semiconductor Manufacturing Technology from National Chiao Tung University.
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