Austin Chiu

Austin Chiu is a principle engineer at TSMC with 8 years of experience, specializing in advanced node CPI. They currently serve as a Senior Engineer, focusing on Flip-Chip/CoWoS CPI stress assessment, layout design, and design rule evaluation. Prior to this role, Austin was a Backend Specialty RD Engineer at TSMC, where they contributed to BEOL novel RDL development and new architecture development in WLCSP and flip chip. Austin holds a bachelor's degree in Chemical Engineering Technology from National Taipei University of Technology and a master's degree in Chemical Engineering from National Cheng Kung University.