Benny Chan

Benny Chan currently serves as a Senior Process Integration Engineer at TSMC, focusing on 3DIC and SOIC new technology development since June 2021. Prior to this role, Benny was at United Microelectronics Corporation (UMC) from September 2017 to June 2021, where responsibilities included overseeing new Test Vehicle Shuttle and customer S/A T/O handling support, along with FinFET process development. Benny holds a Master of Science in Chemistry from National Tsing Hua University and a Bachelor's degree in Chemistry from City University of Hong Kong. Additionally, Benny has experience as a visiting scholar at Kiel University and as an exchange student at the University of Wisconsin-Madison.