Cary Chou

Cary Chou is a Principal Engineer at 台積電, where they focus on SOIC etching and COWOS assembly processes. Previously, Cary worked as a Field Application Engineer at 台積電, successfully developing a vacuum function for underfill recipes. They began their career as a Senior Engineer at Powertech Technology, Inc, where they designed wire bond processes for clients including Intel and Apple. Cary holds a Bachelor's degree in Mechanical Engineering from 國立臺灣海洋大學 and a Master's degree in Aerospace Engineering from 國立成功大學.