Chen Chun-Kai

Chen Chun-Kai is an experienced CVD Process Engineer in R&D at TSMC, having held the position since October 2015, following an internship in the same department in July 2014. During the internship, Chen Chun-Kai co-developed a new continuous deposition recipe to enhance wafer throughput and experimented with carrier gas substitutions to reduce costs. Academic credentials include a Master's degree in Materials Science and Engineering from Stanford University, obtained between 2013 and 2015, and a Bachelor of Science in the same field from National Chiao Tung University, completed in 2012.