Cheng-Chieh Li is an R&D Manager at TSMC, specializing in advanced bonding techniques for various semiconductor packaging applications. They have developed innovative methods such as fluxless reflow and Thermal Compression Bonding, as well as techniques for less than 10-micron pitch micro-bump joints. Previously, Cheng-Chieh gained experience as a Principal Process Engineer at TSMC and held postdoctoral fellowships at Northwestern University and National Taiwan University. Cheng-Chieh earned a Ph.D. in Materials Science from National Taiwan University and was a visiting scholar at Caltech.
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