Chia-Ming Hsu is a Technical Section Manager at TSMC, where they are currently involved in AI and HPC applications, specifically overseeing the TSV and HBM4 project. They have been with TSMC since 2014, serving as a Principal Engineer focusing on various aspects of process integration and device performance enhancement for 7nm and 5nm technologies. Chia-Ming earned a Bachelor of Science in Electrical and Electronics Engineering from National Tsing Hua University and holds both a Master's degree and a Ph.D. in Nano-Electronics from National Taiwan University.
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