Ching-Kai Shen is a principal engineer at TSMC, specializing in sensor and system integrated product development since February 2014. Previously, Ching-Kai held positions as a senior engineer in R&D process integration and MEMS process integration at TSMC, focusing on developing advanced process technologies and maintaining MEMS sensor manufacturing platforms. Prior to TSMC, Ching-Kai worked as a firmware engineer at ASUS, where responsibilities included maintaining and developing Laptop BIOS systems, and at Domintech Co.,Ltd. and RichWave Technology as a MEMS engineer, designing structures for motion sensors and performing simulations for mechanical behaviors. Ching-Kai holds a master's degree in Electrical Engineering (Optoelectronics) and a bachelor's degree in Mechanical Engineering, both from National Taiwan University.
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