ChingHua Chiu is an experienced professional in chip process development and yield improvement, currently serving as Section Manager at TSMC since May 2015. Prior to this role, ChingHua worked as Principal Engineer at Cyntec Corp. from December 2014 to May 2015, focusing on packaging process development. ChingHua also held the position of Section Manager at TSMC SSL from January 2010 to November 2014, specializing in high efficiency and low-cost LED development, particularly in flip chip component packaging. ChingHua holds a Doctor of Philosophy (PhD) in Electro-Optics from National Chiao Tung University and a Master's degree in Power Mechanical Engineering from National Tsing Hua University.
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