Daniel Lin

Daniel Lin is a Principal Engineer at 台積電 since June 2020, specializing in advanced 3D package modeling, signal integrity/power integrity analysis for 2.5D/3D packaging, and high-speed I/O design. Prior to this role, Daniel served as a Project Researcher at 緯創資通 from December 2015 to June 2020, where responsibilities included antenna design for mmWave projects, radar module development, and serving as a visiting engineer at the Massachusetts Institute of Technology. Daniel's career began as a Senior RF Engineer at HTC from September 2013 to November 2015, focusing on RF hardware design across various communication technologies. Daniel holds a PhD in Electrical, Electronics, and Communications Engineering as well as a Master of Engineering, both from National Chiao Tung University.