Gary Chen

Gary Chen is an accomplished professional with extensive experience in the semiconductor industry, currently serving as Section Manager, Technical Manager, and TSMC Principal Engineer at 台積電 since November 2017. In this role, Gary specializes in 3D-IC R&D, focusing on Fan-out and CoWoS processes, as well as packaging heat dissipation solutions. Prior to this, Gary completed a PhD in Materials Engineering at 國立中央大學, where research included low-temperature joint and bonding processes, failure analysis, and material interface analysis from March 2015 to November 2017. Additionally, a summer internship as a dry etching process engineer at 台積電 in July 2014 provided valuable hands-on experience in the field. Gary holds both a Doctorate and a Master's degree in Materials Engineering from National Central University.