Geoffrey Yeap

Geoffrey Yeap is the Vice President of Research & Development, Platform Development at TSMC. Geoffrey has over 25 years of experience in the semiconductor industry and has held various positions at Qualcomm, Motorola Mobility, Advanced Micro Devices, and The University of Texas System Center for Supercomputing.

Yeap started their career as a Research Staff Engineer at The University of Texas System Center for Supercomputing where they worked on developing high performance computing systems. Geoffrey then joined Advanced Micro Devices as a Senior Staff Engineer where they worked on the development of flash memory products. In 1995, they joined Motorola Mobility as a Senior Department Manager and Distinguished Member of Technical Staff. At Motorola, they worked on developing wireless R&D lab and DigitalDNA Lab technologies. Geoffrey was also responsible for the process integration and device design/optimization for Motorola PowerPC and Network Processors. Geoffrey pioneered low power CMOS technology cost-optimization and process-simplification for cost sensitive consumer wireless applications such as world class phones like Star-Tac and Razr as well as other communication gears from Motorola.

In 2004, Yeap joined Qualcomm as the Vice President of Engineering. Geoffrey was responsible for the development and commercialization of Qualcomm’s 3G/4G modem chipsets and system software. Geoffrey also led the engineering team that developed the world’s first commercially available 5G modem chipset. Geoffrey left Qualcomm in 2016 to join TSMC as the Vice President of Research & Development, Platform Development.

Geoffrey Yeap received their Ph.D. in Electrical & Computer Engineering from The University of Texas at Austin, specializing in Microelectronics.

Their manager is C. C. Wei, Vice Chairman & CEO. Some of their coworkers include Cliff Hou - SVP, Research & Development and Technology Development, David Keller - President & CEO, TSMC North America, and Connie Ma - VP HR.