Gordon Huang is currently a Section Manager at TSMC, having previously worked as a Principal Engineer at the same company. From 2012 to 2019, they served as a Senior Process Engineer at Egis Technology, where they focused on fingerprint sensor product development and collaborated across departments for problem analysis and solutions. Gordon obtained a Master's degree in Mechanical Engineering from 中原大學 between 2010 and 2012. They possess a Lean Six Sigma certification and have extensive experience in processes related to underfill, mold, packaging saw, AOI, and SPI.
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