Harry Hu is an engineer manager at TSMC specializing in lithography, focusing on achieving quality, availability, and cost goals in high-volume semiconductor manufacturing. Previously, Harry held positions at Intel Corporation from 2012 to 2021 as a Senior Process Engineer, where they led technical initiatives for the 10nm technology ramp and collaborated with global teams to enhance manufacturing processes. Before that, Harry was a research assistant at NanoPower Research Lab and Rochester Institute of Technology, contributing to advancements in organic solar cell efficiency and developing innovative lithography techniques. With a Bachelor’s and Master’s degree in Micro-electronic Engineering and Materials Sciences & Engineering from Rochester Institute of Technology, Harry continues to drive progress in their current role at TSMC.
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