Huiling Shang is a seasoned technical leader with extensive experience in the semiconductor industry, currently serving as Technical Director at TSMC since December 2014. Prior to this, Huiling held multiple roles at IBM Semiconductor Research and Development Center, including 10nm Platform Project Manager and 22/20nm Device Manager from September 2008 to October 2014, as well as 45nm Bulk Device Manager and Technical Assistant to the Vice President from January 2006 to August 2008. Huiling began a career at IBM T.J. Watson Research Center as a Research Staff Member from July 2001 to January 2006. Educational achievements include a Ph.D. in Electrical Engineering from Lehigh University, obtained between 1997 and 2001.
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