James Davia is a Senior Process Engineer at TSMC, specializing in Extreme Ultra Violet Photolithography to enhance efficiency and quality in a high manufacturing environment, with a focus on BEOL fabrication. Previously, James held roles as a Process Engineer at TSMC and worked as a Process Engineer Intern at Leonardo. Their educational background includes a Bachelor of Science in Materials Science Engineering from the University of Arizona, where they also contributed as an Equipment Engineer.
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